The thin laser beam is best suited for marking in narrow spaces such as on electronic components. The 3-Axis laser control corrects distortion and displacement that may be caused by a slight misalignment that occurred during installation. The thin laser beam enables uniform and precisely positioned marking not only at the center but also at the edges of the marking area.
Distortion problems associated with the properties of the fθ lens of conventional systems have been eliminated, so characters stay clear and crisp over the entire marking area.
The dedicated software easily corrects the head inclination after installation using X, Y, and Z axes adjustment, without the need for a mechanical device.
The wavelength of the laser beam has been shortened from 10.6 to 9.3 μm in order to match the laser beam to the heat absorption characteristics of plastics such as PET or PC. The 9.3 μ m short pulse width laser clearly marks characters of high visibility in shallow incisions with fewer edges, guaranteeing high quality in marking and processing.
There is a lot of damage, and the surface is inscribed roughly.
Precise and shallow marking with less damage