A highly-rigid, adjustable-height stand attaches to the back of the VK microscope, allowing the measuring head to be adjusted to any height. Inserting a spacer between the measuring head and the base improves the stability and enables high accuracy measurement.
A large selection of lenses are available, including high N.A., APO, long focal distance, and low magnification lenses.
An entire 300 mm (11.81") wafer can be examined and analyzed. Easy-to-mount design.
The motorized stage is essential to automatic image assembly and programmable operation. Easy-to-mount design.
Non-destructive examination and analysis of any point on largesized targets by mounting the head on a 3rd-party stage.
This software module complies with ISO 25178 and allows users to complete measurements of several surface parameters. Parameters that can be measured include height, spatial, hybrid, functional, and functional volume measurements.
Divide areas above (projections) or below (indentations) a specified height threshold value into separate zones, and take measurements for each area.
Surface of metal component after processing (3000x)
When a standard sample has been registered and a different image is opened in a template, the VK-Analyzer automatically adjusts the image position so that the image opens at the same position as the registered sample. This function is effective when measuring large sample populations.
Wire bonding (1000x)
Analyzes the difference between two images as a solid 3D image. Enables surface-based image analysis that can capture minute changes.
Automatically extracts the radii of circular objects in a specified area. Since the measurements are calculated automatically, this function reduces variations in measurements between users.
Automatically counts and measures circular objects within the microscope field. Preprocessing such as automatic separation of adjacent particles, counting, diameter, etc can be performed.