VK-X100/X200 series

3D Laser Scanning Microscope

System Configuration

System Configuration

VK Laser Scanning Microscope Options

VK Laser Scanning Microscope Options

Adjustable-height Stand for the VK Series

A highly-rigid, adjustable-height stand attaches to the back of the VK microscope, allowing the measuring head to be adjusted to any height. Inserting a spacer between the measuring head and the base improves the stability and enables high accuracy measurement.

Objective Lenses

Objective Lenses

A large selection of lenses are available, including high N.A., APO, long focal distance, and low magnification lenses.

300 mm (11.81") Wafer Stage

300 mm (11.81") Wafer Stage

An entire 300 mm (11.81") wafer can be examined and analyzed. Easy-to-mount design.

Motorized Stage

Motorized Stage

The motorized stage is essential to automatic image assembly and programmable operation. Easy-to-mount design.

Separate Measuring Head

Separate Measuring Head

Non-destructive examination and analysis of any point on largesized targets by mounting the head on a 3rd-party stage.

ISO 25178
Surface texture measurement module VK-H1XR

Surface texture measurement module VK-H1XR

This software module complies with ISO 25178 and allows users to complete measurements of several surface parameters. Parameters that can be measured include height, spatial, hybrid, functional, and functional volume measurements.

2D & 3D Measurement Tools
Analysis Expansion Module VK-H1XP [Optional]

Indentation/Projection Measurement

Divide areas above (projections) or below (indentations) a specified height threshold value into separate zones, and take measurements for each area.

Indentation Measurement

Indentation Measurement

Surface of metal component after processing (3000x)

Projection Measurement

Projection Measurement

Bump (2000x)

Position Compensation Function [Industry’s First]

When a standard sample has been registered and a different image is opened in a template, the VK-Analyzer automatically adjusts the image position so that the image opens at the same position as the registered sample. This function is effective when measuring large sample populations.

Automatic Position Compensation

Automatic Position Compensation

Wire bonding (1000x)

Height Difference Analysis Function

Height Difference Analysis Function

Analyzes the difference between two images as a solid 3D image. Enables surface-based image analysis that can capture minute changes.

Sphere/Surface Angle Measurement

Automatically extracts the radii of circular objects in a specified area. Since the measurements are calculated automatically, this function reduces variations in measurements between users.

Sphere Measurement

Sphere Measurement

Microlens (1000x)

Particle Analysis Module VK-H1XG [Optional]

Particle Analysis Module VK-H1XG [Optional]

Automatically counts and measures circular objects within the microscope field. Preprocessing such as automatic separation of adjacent particles, counting, diameter, etc can be performed.

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