Ultra-High Speed In-line Profilometer

LJ-V7000 series

Applications

Unbeatable Performance in Automation and Sensing Applications. LJ-V Series Ultra-High Speed In-line Profilometer Catalog

2D MEASUREMENT

HEIGHT AND STEP DIFFERENCE - Pin height and step height measurement

WIDTH AND POSITION - Building material board positioning

PROFILE AND CROSS SECTION - Sealant inspection

WARPAGE AND FLATNESS - Warpage measurement of Sealant inspection PCBs

ANGLE AND RADIUS - Angle measurement of processed products

THICKNESS MEASUREMENT - Case thickness measurement

3D MEASUREMENT (IMAGE PROCESSING)

Soldering bridge and volume inspection

Traditional cameras - Inspection is difficult due to influence from PCB patterns and solder surface conditions. / LJ-V + Image processing - Inspections including solder presence, bridging, and volume can be performed.

Tailored blank welding appearance inspection

Traditional cameras - Inspection using the camera is difficult because the surface conditions of the workpiece are not stable. / LJ-V + Image processing - Stable inspection is possible regardless of the workpiece surface.

Card number character recognition (OCR)

Traditional cameras - Detection is difficult due to influence from the background. / LJ-V + Image processing - Reliable character recognition (OCR) is possible no matter what kind of card is being used.

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Measurement Sensors