Recommended Applications

• [SI-F Series]

  Measureing wafer thickness

  

  The micro-head can be used to measure the thickness and warpage of high-precision objects such as silicon wafers.

• [LK-G Series: Wide Spot Type]

  Reliable Measurement of Rough Surfaces

  

  Diffused reflections from rough surfaced targets are averaged, preventing data fluctuations.

• [LJ-G Series]

  Measuring the height at multiple points in a specified range

  

  The average, peak or bottom height can be measured. Warpage or swell is measured by calculating the heights at specified points.

• [IL Series]

  Height difference measurements of a plastic extrusion

  

  Provides constant monitoring by measuring the height using 2 sensors simultaneously, then calculates the height difference using the calculation function in the amplifier. Reliable detection is possible even if the product type or color changes.