Spectral-Interference Wafer Thickness Meter

SI-F80R series

Overcomes Historical Problems

[Conventional Method]
Contact measurement

Contact measurement


• There is a risk of breaking wafers when measuring.
• Since the sensor measures the height including the BG tape, if the thickness of the tape changes, there is an error of that amount.


Non-contact measurement of wafers sandwiched between two sensors

Non-contact measurement of wafers sandwiched between two sensors


• Very hard to align the optical axes of two sensors.
• Since the sensors measure the thickness including the BG tape, if the thickness of the tape changes, that creates error.

SI-F80R Series

Simple, accurate measurements next to the line

Simple, accurate measurements next to the line


• The sensor can easily make measurements just by being positioned 80 mm (3.15") from wafers.
• Non-contact so wafers are not damaged.
• The sensor can directly measure just wafer thickness, so measurements are not influenced by BG tape thickness.

Constant monitoring inside the line

Constant monitoring inside the line

• With a small head that can be installed 80 mm (3.15") from the wafer, wafer thickness can be constantly monitored inside equipment while polishing.

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Measurement Sensors