Spectral-Interference Wafer Thickness MeterSI-F80R series

SI-F80R

Sensor Head, Wafer Thickness Measurement Type

SPECIFICATIONS

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Model

SI-F80R*1

Type

Wafer thickness measurement type Sensor head

Measurement range

10 to 310 µm 0.000394" to 0.0122" (when n=3.5)*2

Possible detection distance

80 to 81.1 mm 3.15" to 3.19"

Light source

Infrared SLD Output 0.6 mW, Class 1 Laser Product (IEC60825-1, FDA (CDRH) Part 1040.10 *3 )

Spot diameter

ø25 µm ø0.000984"*4

Linearity

±0.1 µm ±0.000004" (when n=3.5)*5

Resolution

0.001 µm *6

Sampling cycle

200 µs

LED display

Target near center of measurement range : green lights. Target within measurement range : orange lights.
Target outside measurement range : flashes orange.

Temperature fluctuation

Environmental resistance

Enclosure rating

IP64

Operating ambientluminance

Incandescent lamp or fluorescent lamp : 10000 lux max.

Operating temperature range

0 to +50°C 32 to 122°F

Operating ambient humidity

35 to 85%RH (No condensation)

Vibration

10 to 55 Hz, 1.5 mm 0.06" double amplitude in X, Y, and Z directions, 2 hours respectively

Material

SUS

Weight

Approx 70 g (including cable)

*1 The sensor head and spectrum unit are calibrated as a pair. They are not interchangeable.
*2 Indicates the thickness measurement range when the refractive index is 3.5. (The thickness measurement range is 35 to 1100 µm0.001378" to 0.0433" when the refractive index is 1.)
*3 The laser classification for FDA (CDRH) is implemented based on IEC60825-1 in accordance with the requirements of Laser Notice No. 50.
*4 Indicates the minimum beam spot diameter within the measurement range.
*5 This value is obtained by measuring the gap between two glass plates with the number of averaging measurements set to 256, converted to a refractive index of 3.5.
*6 This value is obtained by measuring a 0.3 mm 0.01" thick glass target within the possible detection distance with the number of averaging measurements set to 4096.

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