Spectral-Interference Wafer Thickness MeterSI-F80R series

SI-F80RU

Spectroscopy Unit

SPECIFICATIONS

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Model

SI-F80RU

Type

Wafer Thickness Measurement Type Spectrum Unit

Measurement range

10 to 310 µm 0.000394" to 0.0122" (when n=3.5)*1

Possible detection distance

80 to 81.1 mm 3.15" to 3.19"

Light source

Infrared SLD Output 0.6 mW, Class 1 Laser Product (IEC60825-1, FDA (CDRH) Part 1040.10 *2 )

Spot diameter

ø25 µm*3

Linearity

±0.1 µm ±0.000004" (when n=3.5)*4

Resolution

0.001 µm *5

Sampling cycle

200 µs

LED display

Target near center of measurement range : green lights. Target within measurement range : orange lights.
Target outside measurement range : flashes orange.

Temperature fluctuation

0.01% of F.S./°C

Environmental resistance

Enclosure rating

Operating ambientluminance

Incandescent lamp or fluorescent lamp : 10000 lux max.

Operating temperature range

0 to +35°C 32°F to 95°F

Operating ambient humidity

35 to 80%RH (no condensation)

Vibration

10 to 55 Hz, 0.5 mm 0.02" double amplitude for 2 hours in each of the X, Y, and Z directions

Material

Polycarbonate

Weight

Approx 1.2kg

*1 Indicates the thickness measurement range when the refractive index is 3.5. (The thickness measurement range is 35 to 1100 µm0.001378" to 0.0433" when the refractive index is 1.)
*2 The laser classification for FDA (CDRH) is implemented based on IEC60825-1 in accordance with the requirements of Laser Notice No. 50.
*3 Indicates the minimum beam spot diameter within the measurement range.
*4 This value is obtained by measuring the gap between two glass plates with the number of averaging measurements set to 256, converted to a refractive index of 3.5.
*5 This value is obtained by measuring a 0.3 mm thick glass target within the possible detecting distance with the number of averaging measurements set to 4,096.

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