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IL Series CMOS Analog Laser Sensor
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Applications

An Even Wider Range of Applications

A Variety of Uses at Low Cost

For more details, download the PRODUCT CATALOG by clicking the CATALOG icon above.



Height difference measurements of a plastic extrusion
Height difference measurements of a plastic extrusion
Provides constant monitoring by measuring the height using 2 sensors simultaneously, then calculates the height difference using the calculation function in the amplifier. Reliable detection is possible even if the product type or color changes.
Warpage detection in ceramic boards
 
Warpage detection in ceramic boards
As the sensor head is compact, multiple point measurements of small-scale boards are possible. By calculating the measurement data externally, simultaneous measurements of positioning and warpage are possible.
Thickness/width measurements of building material boards
Thickness/width measurements of building material boards
Thickness and width can be simultaneously measured immediately after the extrusion process. In addition, man-hours for setup and product changeovers are reduced using the thickness calibration function.



Packaging material counting
 
Packaging material counting
Even in targets with a large amount of shape scatter, reliable counts can still be achieved by detecting rising edges. The output signal is then sent to a counter or other device.
Accuracy checks on an automotive door assembly
Accuracy checks on an automotive door assembly
When assembling automotive doors, by simultaneously measuring multiple points, the assembly accuracy can be evaluated. Reliable detection is possible regardless of body color.
Positional control of welding beads
 
Positional control of welding beads
Through external calculations of height data from the sensor, the device detects the position of the weld seam. Welding accuracy can be improved via measurement data feedback to the welder.



Heat processing inspection of cans
 
Heat processing inspection of cans
By observing the expansion displacement of a can after heat processing, the results of heat processing can be evaluated. Reliable differentiation can still be conducted even if there are color changes in the cans.
Height controls of a hoop material
 
Height controls of a hoop material
By using a long range type of sensor head, it is possible to control height of hoop materials such as steel plates and sheet materials even during transportation. The sensor head
can be installed at a distance of up to 1000 mm 39.37".
Differentiation of different types of plastic components
Differentiation of different types of plastic components
Reliable differentiation, even in highly variable small parts, using a high-precision sensor head. Even when the variety changes, external changeover of up to 4 patterns is possible by setting items in the bank function.



Stacker device counts and stacking disturbances
Stacker device counts and stacking disturbances
The IL Series counts how many items are being transported along a conveyer, in addition to the noncontact detection of uneven stacking in the stacker. Reliable detection regardless
of color changes in the targets.
Wire winding process
 
Wire winding process
Prevents irregular winding by monitoring the traverser position. In addition, feedback control to the device is possible by measuring the volume wound into the bobbin at the same
time.
Height controls of a PC board
 
Height controls of a PC board
Controls the PC board height in the mounting and drilling processes. Various kinds of targets can be reliably controlled without being affected by the surface colors of the PC boards.



Detection of stage inclination prior to furnace transportation
 
Detection of stage inclination prior to furnace transportation
Calculates the inclination by measuring multiple points on the stage prior to transferring to the furnace. Transferring the product after correcting the inclination allows for consistent temperature control.
Behavior detection in an operational unit
 
Behavior detection in an operational unit
Measures the behavior of each unit in the device. Due to the small head footprint, the IL series can be installed in compact spaces. This means that the IL series can be installed even after the machinery has been set up.
Misalignment measurement and presence detection of a wafer/glass in a cassette.
Misalignment measurement and presence detection of a wafer/glass in a cassette.
Measures the presence and protrusion of glass in a cassette. Stable detection is possible even if positional misalignments occur in the cassette itself by utilizing analog processing.



Measuring the height of a chip after bonding
Measuring the height of a chip after bonding
Measures the height of the board pre-bonding and the chip postmounting, allowing control of the postprocessing suction nozzle and dispenser nozzle feedback.
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Product catalogs and manuals include both sensor head and amplifier information.
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