It is possible to detect changes wire pitch due to heat build up
allowing for stable measurement due to small temperature
Introducing the world’s first micro-head, with the highest
measurement accuracy in its class and a level of performance that
was previously thought impossible.
With the adoption of the near-infrared SLD, thickness measurement
for the wafer alone is possible even while BG tape is affixed. Even
when there is strong pattern-based variation on the surface of the
wafer, accurate in-line measurement is possible.
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