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          Micro-head Spectral-interference Laser Displacement Meter

          SI-F series

          SI-F Series Applications

          Unbeatable Performance in Automation and Sensing Applications.

          Measuring wafer thickness

          The micro-head can be used to measure the thickness and warpage of high-precision objects such as silicon wafers.

          Measuring wafer thickness

          [ADVANTAGE]
          Ultra high-resolution

          Resolution of 0.001 μm 0.00004 mil

          Multifunctional controller

          The arithmetic operation circuit instantly converts the measurement data to a thickness.

          No heat generation

          There are no electrical components in the head that generate heat.

          Measuring the behavior of rollers in a copy machine

          The micro-head can be used to measure the behavior of each component inside precision machines such as copy machines.

          Measuring the behavior of rollers in a copy machine

          [ADVANTAGE]
          ø2 mm ø0.08" micro-head

          No special location is needed for installation.

          Heat resistant to 85°C 185°F

          Measurement is possible even beside an exothermic body.

          5-kHz high-speed sampling

          Even high-speed targets can be measured securely.

          Positioning high-accuracy stages

          The micro-head can be used to detect the location at which a stage stops, allowing the difference from the reference value to be fed back to the related equipment.

          Positioning high-accuracy stages

          [ADVANTAGE]
          Setting distance of 10 mm 0.39" or longer

          There is no danger of collision.

          Up to six-axis simultaneous measurement

          Multi-axis control is achieved with no time errors

          ø8 mm ø0.47" small head

          No special location is needed for installation.

          Measuring roller run out with high accuracy

          The micro-head can be used to measure the run out in rollers, which demand precise measurement, such as in the case of coating rollers.

          Measuring roller run out with high accuracy

          [ADVANTAGE]
          No damage to workpiece

          Non-contact measurement prevents damage to workpieces.

          Direct indication of amount of run out

          The amount of run out is instantly calculated and displayed by the controller.

          5-kHz high-speed sampling

          The high-speed rotation of target objects can be followed.

          Measuring exposure mask gaps

          The micro-head can be used to measure the gap between an exposure mask and glass substrate.

          Measuring exposure mask gaps

          [ADVANTAGE]
          Setting distance of 80 mm 3.15"

          The micro-head can be installed even when the mask is thick.

          ø12mm ø0.47" small head

          No special location is required for installation.

          No heat generation

          There are no electrical components in the head to generate heat.

          Measuring the thickness of glass discs

          The micro-head can be used to measure the thickness of optically transparent targets, such as glass discs.

          Measuring the thickness of glass discs

          [ADVANTAGE]
          Ultra high-resolution

          Resolution of 0.001 μm 0.0004 mil

          5-kHz high-speed sampling

          The thickness of rapidly rotating targets can be measured.

          Up to six-axis simultaneous measurement

          Multi-axis control is achieved with no time errors.

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