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          Spectral-Interference Wafer Thickness Meter

          SI-F80R series

          Overcomes Historical Problems

          [Conventional Method]
          Contact measurement

          Contact measurement


          • There is a risk of breaking wafers when measuring.
          • Since the sensor measures the height including the BG tape, if the thickness of the tape changes, there is an error of that amount.


          Non-contact measurement of wafers sandwiched between two sensors

          Non-contact measurement of wafers sandwiched between two sensors


          • Very hard to align the optical axes of two sensors.
          • Since the sensors measure the thickness including the BG tape, if the thickness of the tape changes, that creates error.

          SI-F80R Series

          Simple, accurate measurements next to the line

          Simple, accurate measurements next to the line


          • The sensor can easily make measurements just by being positioned 80 mm (3.15") from wafers.
          • Non-contact so wafers are not damaged.
          • The sensor can directly measure just wafer thickness, so measurements are not influenced by BG tape thickness.

          Constant monitoring inside the line

          Constant monitoring inside the line

          • With a small head that can be installed 80 mm (3.15") from the wafer, wafer thickness can be constantly monitored inside equipment while polishing.

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          Measurement Sensors