The WI-5000 uses spectral interference to collect 80,000 points of height data to capture accurate 3D images in 0.13 seconds, without moving the part.
The sensor simplifies the inspection process by making it easier to capture and record measurements from a 3D image. It can be incorporated into production or used as an inspection station.
Using the 3D image, the sensor can measure many aspects, from height difference and width, all the way to planarity and volume.
The WI-5000 can accurately image almost any material type including metal, rubber, and glass.
Flatness
BGA Planarity
Solder Height and Volume
Bent Pins
Click here to get more information on the WI-5000.
* required
7 characters minimum, no spaces
