Semiconductor

Detecting wafer notch position with a 2D laser profiler eliminates the risk of missing the notch when the wafer is slightly warped.

The pitch of the saw wires can vary with temperature and the form of the main roller. Regular pitch measurement makes it easy to see when to replace rollers.

Track stage position with a resolution of 1 nm using the SI-F1000 Series. The sensor head doesn't generate heat, so you can avoid any measurement or position error of the stage due to thermal expansion.

Reduce reactive maintenance by inspecting dicing blade thickness at regular intervals. By checking more often, you can detect chipped edges in the thin blades prior to breakdown. By opposing two confocal sensors, you can reliably measure thickness around the blade edge without causing damage.

By monitoring the home position of the end effector, you can detect minute changes before they cause a collision between the wafer and wafer carrier. Using a long range displacement sensor enables end effector position measurement through a viewport.

Automate groove depth measurements using the WI-5000. The WI can measure mirrored or transparent surfaces without issue. By automating inspection, you can reduce cycle time and avoid common pitfalls of microscope measurements such as human error or inconsistent inspection location.

Measure the profile of a wafer edge. By selecting one of the inspection tools such as Height Difference/Width or Angle, users can start measurement easily. The high-resolution image capturing using 3200 points/profile achieves highly accurate profile measurement that was impossible with conventional methods.

Thanks to the small head size, CL-3000 Series devices can be easily installed on equipment for accurate distance measurement. The sensor can measure both diffuse and mirrored surfaces accurately, without any mounting adjustments.

The special sensor head fixture combined with the optical-axis alignment function makes high-accuracy thickness measurement easy to perform for all targets. This allows for stable measurement even for wafers with rough surfaces.

Non-contact measurement of ingots and other large targets is possible by using two sensor heads. Measurement of the outer diameter and the circularity is also possible by rotating the target.

Highly glossy grooves can be difficult to inspect using non-contact measuring instruments due to diffuse reflections and other factors. The LJ-X Series, however, includes unique functions that can suppress such effects for stable shape measurement.