Vision Examples in the Electronic Device Industry

Typical vision applications for the inspection of electronic devices

The trend toward miniaturization and low-profile design is accelerating in home electronics, including smartphones, gaming consoles and PCs. This has promoted the miniaturization and integration of semiconductors and electronic components, and generated demand for higher inspection accuracy. As high-mix low-volume production and cell production have become common and products have diversified, labor and costs for inspection are increasing.

Electronic components such as IC chips, resistors, capacitors, and transistors are so small that they sometimes must be inspected not only visually but also with microscopes. Labor increases exponentially along with this increase in parts to be inspected. This has led to significant increases in labor and facility costs and reduced production efficiency.

Machine vision has increasingly been introduced for inspection in production to remedy this situation. Machine vision is versatile and can perform multiple inspections simultaneously. They are suitable for the needs of the electronic device industry where high-mix low-volume production and cell production are becoming common.

With the recent availability of high-pixel cameras and high-performance image processing systems, various operations can now be automated, such as appearance inspection, dimension inspection, character/2D code-based identification, and positioning/alignment. Using machine vision also facilitates data management. The ability to build a product management database and conduct factor analysis based on past NG products helps to improve facilities and quality. The following are typical examples of how machine vision has been utilized in the electronic device industry.

Product Presence, Type, and Orientation

Check the presence/orientation of IC chips in carrier tape using machine vision.

Key inspection points

Detects the presence and orientation of IC chips allowing the carrier tape to be advanced to skip any pocket that is missing a part or has product oriented incorrectly.

Recognition result with machine vision

Check for the presence of plating on lead frames using machine vision.

Key inspection points

Ensures coating quality by detecting subtle color changes or pealing, even on high-speed production lines.

Recognition result with machine vision

Check the presence and orientation of IC chips on a tray using machine vision.

Key inspection points

Conduct various inspections of IC chips on a tray with a single machine vision. Line scan cameras allow simultaneous inspection of targets over large areas.

Recognition result with a line scan camera

Quality inspection

Check for defective crystal oscillators using machine vision.

Key inspection points

Makes it possible to perform a detailed quality inspection of crystal oscillators by ignoring the influence of texture and individual differences between target.

Recognition result with machine vision

Inspect LED surfaces for defects such as foreign particles or flaws using machine vision.

Key inspection points

Detects foreign particles, linear stains, blisters, flaws, etc. on the surface of LED’s. The high-speed processing can maximize the machine yield rate.

Recognition result with machine vision

Using machine vision, check for appearance defects such as flaws or dents on the printed surfaces of batteries.

Key inspection points

Appearance inspection of battery surfaces to find flaws or dents was difficult because it was hard to differentiate between printing and defects. The LumiTrax function allows detection of just flaws and dents by canceling 2D information such as printing.

Recognition result with machine vision and LumiTrax

Check for flaws or bulging on IC molds using machine vision.

Key inspection points

Accurate differentiation of flaws or bulging on IC molds was difficult due to the influence of the texture or glare on the surface. Using the LumiTrax function makes this detection possible. It can detect flaws or bulging only by canceling marked characters.

Recognition result with machine vision and LumiTrax

Check for pinholes or wrinkles in capacitor foil using machine vision.

Key inspection points

A line scan camera enables detection of minute pinholes and wrinkles in a moving sheet of capacitor foil.

Recognition result with a line scan camera

Dimensional inspection

Inspect the coplanarity of connector pins using machine vision.

Key inspection points

Detect the light reflected from the tip of connector pins to find minute bends in the pins. A special package of tools for connector inspection eliminates the need for teaching and simplifies inspection settings.

Recognition result with machine vision

Inspect the dimensions of lithium ion batteries using machine vision.

Key inspection points

Using machine vision, inspect the dimensions and angles of multiple sections of a lithium ion battery. The use of a 21 megapixel machine vision allows high-resolution inspection.

Recognition result with a 21 megapixel machine vision

Positioning/alignment

Ensure the assembly alignment of camera modules using machine vision.

Key inspection points

Using a high-pixel, 16x speed machine vision achieves high-accuracy positioning.

Alignment with machine vision

Correct the misalignment of an IC chip picking robot using machine vision.

Key inspection points

KEYENCE's image processing systems support robots from many manufacturers and allow direct connection easily. This can save significant man-hours for startup.

Misalignment correction using machine vision

Product recognition inspection

Read marking on the surface of packaged IC chips and differentiate types using machine vision.

Key inspection points

Read the characters/2D codes laser-marked on the surface of IC chips. A single machine vision can recognize both characters, such as part numbers, and 2D codes simultaneously.

Recognition result with machine vision

Inspect the characters and 2D codes marked on PCBs using machine vision.

Key inspection points

Using a high-pixel machine vision allows an entire PCB to be captured within the field of view. This enables simultaneous inspections to measure connector pitches and other items, as well as to recognize/judge character information and 2D codes.

Recognition result with machine vision

3D Vision inspection

Inspect PCBs for warpage using a laser displacement sensor and 3D vision inspection.

Key inspection points

Recognition of deformation such as warpage was difficult with machine vision. The combination of a laser displacement sensor and image processing system achieves inspection of warpage of PCBs and presence of mounted components based on height information.

Recognition through the use of a laser displacement sensor and 3D measurement

Using a 3D camera, inspect the height of connector terminals or check for bending.

Key inspection points

This allows not only measurement of bending or the pitch of connector pins, but also measurement in the height direction through the use of 3D vision inspection. By using the housing as a reference plane, the system achieves stable inspection regardless of the position or wobbling of targets.

Recognition result with a 3D camera

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