Spectral-Interference Wafer Thickness Meter
Spectral-Interference Wafer Thickness Meter SI-F80R series
With the adoption of the near-infrared SLD, thickness measurement for the wafer alone is possible even while BG tape is affixed. Even when there is strong pattern-based variation on the surface of the wafer, accurate in-line measurement is possible.
- Wafer thickness can be measure even if back grinding tape is affixed
- Minimal pattern influence
- In-line measurement is possible
- Automatically maps the distribution of thickness for the entire wafer