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          4. Need to Mark Resin? 4 Things to Know Before You Start

          Need to Mark Resin? 4 Things to Know Before You Start

          May, 2020

          With the increasing sophistication of electronic products, component parts are becoming smaller and thinner. As such, the role of traceability has expanded beyond the final product to include the individual components.

          However, not all marking applications involve data management. There is a need for film cutting and burr removal, and laser markers are quickly becoming the industry standard for resin marking.

          Mechanism of Resin Marking/Processing

          1 REFLECTION, ABSORPTION AND TRANSMISSION

          In order to understand why lasers can be used for resin processing, it's important to review how light interacts with different materials.

          When light is received, all objects experience “reflection”, “absorption” and “transmission.” This relationship is a very important element for laser marking and laser processing. The ratio of “reflection”, “absorption” and “transmission” of the received light form the pictured relationship.

          Without increasing the temperature of the object, processing becomes more difficult as “reflection” and “transmission” increase. Processing efficiency becomes better as “absorption” increases.

          2 Influence on Materials by Wavelength

          Different wavelengths of light have different degrees of reflection, absorption and transmission on different materials. Industrial laser markers are broadly divided into five types based on the wavelength of the laser beam: CO2 laser markers, YVO4 laser markers, Fiber laser markers, SHG (Green) laser markers, and Ultraviolet (UV) markers.

          In general, a shorter wavelength results in more energy generated and a higher ratio of absorption.

          3 Damage-Free Marking With UV Lasers

          As electronic components continue to shrink in size, sealing resin also continues to get thinner. As the clearance between the component surface layer and the internal circuit shrinks there is increased risk of component damage due to penetration of the laser light.

          UV laser marking reduces the risk of damage because UV laser light is efficiently absorbed by a wide range of materials, yielding a transmission ratio of around 1/5 that of standard wavelength lasers.

          Additionally, whereas standard wavelength lasers create an uneven marking surface, UV lasers make it possible to obtain a marking surface with a uniform etched depth

          Standard wavelength laser 1064 nm

          UV laser 355 nm

          4 Major Types of Marking/Processing on Resin

          Thanks to their high absorption rates on resin, UV laser markers are perfect for resin marking and processing applications. Some of the most common include:

          • Paint peeling - Peel the paint/printing on the target surface to expose the color of the base material.
          • Surface layer peeling - Remove/engrave the surface layer of a material.
          • Color development - Change the color of the target through irradiation.
          • Welding - Use heat to weld and join parts together.

          KEYENCE has been an innovative leader in the laser marking industry since the early 1990’s. Our high speed, precision processing capabilities have evolved to include the world's first 3-Axis lasers and unrivaled marking quality among UV, Fiber and CO2 systems. The newest laser markers from KEYENCE are built upon years of experience and hands-on application knowledge. KEYENCE is committed to introducing new cutting-edge products that go beyond the expectations of its customers.

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