Temperature measurement during service life testing of electronic components

To evaluate the service life of components, temperature distribution data is collected by repeatedly applying a high- or low-temperature heat stress to electronic devices. Various effects of temperature are verified through, for example, repeated testing under harsh conditions (such as electrical conduction while exposed to high temperatures); inspection of deformation, cracking, etc. due to heat; and confirmation of the durability of molded products that combine different materials such as plastic and metal. In addition to temperature measurement, the NR Series multi-input data logger enables you to simultaneously perform different types of measurement by connecting units such as a strain measurement unit and a high-speed, high-voltage measurement unit, reducing the total time required for measurement.