Thickness can be measured in process
Small sensor heads can be places at several locations and the measurements are automatically synchonized
Introducing the world’s first micro-head, with the highest measurement accuracy in its class and a level of performance that was previously thought impossible.
With the adoption of the near-infrared SLD, thickness measurement for the wafer alone is possible even while BG tape is affixed. Even when there is strong pattern-based variation on the surface of the wafer, accurate in-line measurement is possible.