Height measurement of a wire bond

Height measurement of a wire bond

Semiconductor manufacturing

Defects in bonding wires can cause a ciruit board to malfunction.

Benefit

The 2 μm beam spot and double scanning method ensures stable measurements.

LEARN THE DETAILS OF THE PRODUCT

Back to top

KEYENCE CORPORATION OF AMERICA 500 Park Boulevard, Suite 200, Itasca,
IL 60143, U.S.A.
Phone: 1-888-KEYENCE (1-888-539-3623)
E-mail: tech@keyence.com
Career Opportunities: KEYENCE Career Site