This section introduces applications by industry that are useful in the development of new manufacturing processes.
Electronic Components: Direct Part Marking
Sales of communication devices, such as smartphones and tablets, have rapidly increased in recent years.
As the number of components and the miniaturization of components accelerates, manufacturers must thoroughly implement traceability control to maintain high quality.
The miniaturization of components has made many manufacturers replace conventional machining with laser machining that allows non-contact and accurate operation. The demand for fine, high quality, and less damaging marking has been increasing day by day.
This guide introduces and explains application examples of laser markers for the electronics industry.
Case1.2D code marking
2D code marking on IC chips
Until recently, lot number marking was the only typical marking application on IC chips. Today, there is a growing need for 2D code marking and managing encoded data.
Writing information in a limited space requires much smaller marking.
Micromarking allows for ultra-fine marking, which is impossible with conventional laser markers. Various marking styles can be selected from shallow marking to reduce product damage to deep engraving causing maximum height contrast into the part.
Marking on silicon wafer
When marking on a fi nished wafer surface damage must be minimized to prevent generation of dust. In this case, a green laser is preferable to a standard wavelength laser.
Marking on LED ceramic package
Due to space limitations, the need for 2D codes on ceramic packages is increasing in order to contain all necessary information.
Simultaneous deburring and marking on IC chips
By taking advantage of the capabilities of KEYENCE’s 3-Axis laser markers, you can mark the top surface of IC chips and remove resin burrs in one process.
Since the laser accurately scans only along the edges of the IC, fl ash burrs over the leads can be removed without causing damage to the inside of the package.
Removing gold plating from connector terminals
To prevent solder wicking, lasers are used to remove the gold plating from connector terminals.
In the past, masks were used to avoid unnecessary plating. Today, connectors are designed smaller and thinner, and the pitches between the terminals are narrower. Consequently, it has become common practice to apply plating and then remove it with a laser for micron accuracy.
Removing thin-fi lm coating from coil
Previously, removers or edged tools were generally used to remove thin-fi lm coating from coils. Now, laser markers have become useful because they require no consumables and ensure stable results.
Resin coating removal
In the past, chemicals were used to remove resin to analyze defective molds. The use of chemicals could not only affect the internal circuit, but also require a lot of man-hours. Using a laser to remove resin saves running cost and time.
ITO film patterning
Conventional wet etching uses chemicals for ITO fi lm removal and required preparation of a patterning mask. With a laser marker, chemicals are unnecessary and no running cost is required.
Moreover, various patterns can be used just by creating layout data through simple programming.
Trimming is a process of removing resistance materials, circuit patterns, or evaporated fi lms with a laser to bring electronic components closer to desired performance. This technique is indispensable for manufacturing high quality electronics.
KEYENCE’s laser markers feature fl exible cutting modes to meet any requirement.
Furthermore, you can change the beam spot size and speed during marking to achieve ideal quality.